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Software Applications Engineer (BSP and Memory)

Qualcomm Inc.


Location:
Taipei
Date:
04/19/2018
2018-04-192018-05-19
Job Code:
1963602
Qualcomm Inc.
Apply on the Company Site
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Job Details

Job Title Software Applications Engineer (BSP and Memory)
Jobid 1963602
Location: Taipei City, TWN
Job Description:
**Job Id**
E1963602
Job Title
Software Applications Engineer (BSP and Memory)
Post Date
04/12/2018
Company
-
Division
Qualcomm Technologies, Inc.
-
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
Job Area
Engineering - Customer Engineering
Location
Taiwan - Taipei City
Job Overview
To join Qualcomm Customer Engineering team and work with new Qualcomm Compute products. These Core BSP & Multimedia Customer Engineers are expected to:


- Understand every aspects of customers' requirements and designs


- To communicate with internal product & development teams on any HW/SW design related issues/features from customer designs
Minimum Qualifications
Understanding of Windows and device driver and ARM based CPU and cache architectures

Experience and knowledge in DDR/UFS/NVMe Debugging

Experience in JTAG, ETM Trace debugging

Debugging memory corruptions and memory leaks in user-space
Preferred Qualifications
na
Education Requirements
Master/ Bachelor degree of Computer Science or Electronics Engineering or Computer Engineering.
EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.


Apply on the Company Site
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