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Mechanical Engineer, Senior

Qualcomm Inc.

Job Code:
Qualcomm Inc.
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Job Details

Job Title Mechanical Engineer, Senior
Jobid 1963610
Location: Singapore, SGP
Job Description:
**Job Id**
Job Title
Mechanical Engineer, Senior
Post Date
Qualcomm Technologies, Inc.
CDMA Technology at
Job Area
Engineering - Hardware
Singapore - Singapore
Job Overview
Prepare conceptual design using Pro-E/ Solid works software, provide detail fabrication drawings and assembly drawings ( 2D/3D) of test sockets, socket lids, probe heads and handler change kits to meet project hardware requirements. In addition, he or she must be Knowledgeable with material data sheet to select correct material needed for the job ,ESD requirements, thermal requirements to meet design project needs to support testing.

Supervise selected vendors to prepare project to ensure product quality, yield of product testing, and delivery to final customers. Assist in installation works including setup of equipment, perform qualification, repeatability and reproducibility study and testing.

Resolve any technical issue which may arise in a timely fashion and pro-actively get to understand the root cause of the issue and fix the issue.

Work with selected vendors in providing assembly, explaining requirements , testing, maintaining and trouble shooting.

Work independently and should have in-depth knowledge in Mechanical , thermal engineering to meet internal customer needs and be able to derive design models , perform 3D modelling , stress analysis and must be familiar using metrological instruments.
Minimum Qualifications
1. Must be familiar and hands on experienced in electro mechanical equipment such as 93K, Teradyne testers and ATE handlers such as Seiko , Delta Design, ATC handlers and Synax, sockets, probe cards, stiffeners, probe heads.

2. Candidate must have hands on design knowledge in Semi- conductor Equipments such as probers, sockets , probe card, probe head, socket hand test lid and assembly, fixture, Bench testing and Thermal controlling unit.

3. Must have thorough design experience in the field of sockets , socket lids, probe heads, stiffeners for probe card , TCU , handler change kits , 3D modelling .

4. Candidate must have Pro-E, Solid works , Auto Cad, 3 modelling , thermal analysis , Active thermal control of junction temperature at test.

5. Candidate must be able to design with tolerance dimensioning in the field of sockets , stiffeners, probe heads, handler change kits, fixture designs to solve problems .

6. Candidate must be able to solve any problem related to Semi- conductor test with analytical problem solving skills , thermal dynamic environment.

7. Able to interface with counterparts off-shore , take directions and have initiative to solve problem independently.

8. Candidates must have thorough knowledge in the field of thermal dynamics, stress tolerance analysis , Optical problem solving using metrological instruments.

9. Candidates must be fluent in English , be able to concise reports , Design (Pro-E) and work with vendor to fab a fixture sharing the design files.

10. Candidates is responsible of first article inspection of sockets/ probe heads , change kits based on mechanical drawings to assist debug process till problem is fully resolved.

11. Candidate must be able to work across cross functional team in the organization while solving issues ( Mechanical , thermal , design wise).

12. Candidate must have automation skills to build own automation equipment needed for Qualcomm engineering needs such as Engineering handlers with TCU interface.
Preferred Qualifications
Education Requirements
Minimum Degree in Mechanical Engineering from a recognized university with 4-5 years hands on and design Experience in the field of Semiconductor test.
EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.

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